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一种量子处理器芯片结构及其封装结构
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Release time:2021-07-24
Affilication of Author(s):
中国科学技术大学
Disigner of the Invention:
denghui,gongming,wuyulin,pengchengzhi,zhuxiaobo,panjianwei
Patent description:
实用新型申请
Application Number:
201921168724.1
Number of Inventors:
7
Service Invention or Not:
no
First Author:
Liang Futian
Pre One:
一种芯片封装结构及装置
Next One:
键合结构及包含该键合结构的封装盒体