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嵌段共聚物的制备方法

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Affilication of Author(s):中国科学技术大学

Disigner of the Invention:鲁丹,董其宝,王浦澄,liulei

Patent description:发明

Application Number:201310182759.1

Number of Inventors:5

Service Invention or Not:no

Publication Date:2013-08-21

Authorization Date:2016-03-30

First Author:bairuke

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