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空穴型半导体异质结霍尔棒
Release time:2021-07-24 Hits:
Affilication of Author(s): 中国科学技术大学
Disigner of the Invention: 袁龙,王柯,caogang,guoguangcan,guoguoping
Patent description: 实用新型
Application Number: 201720754071.X
Number of Inventors: 6
Service Invention or Not: no
Publication Date: 2018-04-10
Authorization Date: 2018-04-10
First Author: Li Hai Ou