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改进负温度系数热敏材料均匀性的热处理方法

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  • Affilication of Author(s):合肥三晶电子有限公司;中国科学技术大学

  • Disigner of the Invention:王忠兵,chenchusheng,yangpinghua,刘原平

  • Patent description:发明

  • Application Number:200710025644.6

  • Number of Inventors:5

  • Service Invention or Not:no

  • Publication Date:2008-03-12

  • First Author:赵春花

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