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一种负温度系数双相复合热敏材料及其制备方法

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  • Affilication of Author(s):合肥三晶电子有限公司;中国科学技术大学

  • Disigner of the Invention:yangpinghua,朱运兵,chenchusheng,刘原平

  • Patent description:发明

  • Application Number:200810021261.6

  • Number of Inventors:5

  • Service Invention or Not:no

  • Publication Date:2008-12-24

  • First Author:罗伟

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