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冯志华

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Contact Information:0551-6360894

Degree:Dr

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Current position: Home >> Scientific Research >> Patents
基于电涡流传感器的导电膜厚度测量系统及方法

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Affilication of Author(s):中国科学技术大学

Disigner of the Invention:Hongbo Wang,liwei,琚斌

Patent description:发明

Application Number:201410412326.5

Number of Inventors:4

Service Invention or Not:no

Publication Date:2014-11-19

Authorization Date:2017-11-28

First Author:fengzhihua