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Current position: Home >> Scientific Research >> Patents
可扩展的量子芯片封装盒结构及其制作方法

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Affilication of Author(s):中国科学技术大学

Disigner of the Invention:gongming,denghui,wuyulin,pengchengzhi,zhuxiaobo,panjianwei

Patent description:发明公开

Application Number:201910669893.1

Number of Inventors:7

Service Invention or Not:no

Publication Date:2019-11-19

First Author:Liang Futian