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Current position: Home >> Scientific Research >> Patents
用于超导量子处理器封装的配合结构及封装盒体

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Affilication of Author(s):中国科学技术大学

Disigner of the Invention:杨威风,denghui,gongming,wuyulin,pengchengzhi,zhuxiaobo,panjianwei

Patent description:实用新型申请

Application Number:201921167660.3

Number of Inventors:8

Service Invention or Not:no

First Author:Liang Futian