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Current position: Home >> Scientific Research >> Patents
基于过盈配合的信号连接结构及量子芯片封装盒体

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Affilication of Author(s):中国科学技术大学

Disigner of the Invention:沈慧妍,denghui,gongming,wuyulin,pengchengzhi,zhuxiaobo,panjianwei

Patent description:实用新型申请

Application Number:201921167756.X

Number of Inventors:8

Service Invention or Not:no

First Author:Liang Futian