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龚明

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Degree:博士

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Current position: Home >> Scientific Research >> Patents
一种量子处理器芯片结构及其封装结构

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Affilication of Author(s):中国科学技术大学

Disigner of the Invention:denghui,gongming,wuyulin,pengchengzhi,zhuxiaobo,panjianwei

Patent description:实用新型申请

Application Number:201921168724.1

Number of Inventors:7

Service Invention or Not:no

First Author:Liang Futian