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DOI码：10.1109/TED.2021.3130217

发表刊物：IEEE Transactions on Electron Devices

摘要：We design a skyrmion-magnetic domain interconversion logic gate (SkyMDILogic) gate and use it as a model system to study the geometrical and thermal effects. We particularly focus on the effects of temperature and structural defects. Micromagnetic simulations are used to study the skyrmion movement and characterize the relevant properties. We also construct an equivalent circuit model to calculate the energy consumption and logic operations at different temperatures. We find that temperature significantly affects the stability of a skyrmion. At elevated temperatures, the skyrmion propagation is more robust against the pinning effect of structural defects. Our results highlight the effects of thermal and structural defects, which remained largely unexplored in previous logic gate designs.

学科门类：工学

卷号：69

期号：4

页面范围：1706 - 1712

是否译文：否

发表时间：2021-12-10