一种聚合物微流体系统的热压键合方法
Release time:2021-07-23Hits:
Affilication of Author(s):
中国科学技术大学
Disigner of the Invention:
zhuxuelin,tianyangchao,阚娅
Patent description:
发明
Application Number:
200410103236.4
Number of Inventors:
4
Service Invention or Not:
no
Publication Date:
2006-07-12
First Author:
liugang