刘建伟

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一种银纳米线组装体及其制备方法和柔性导体

Release time:2021-07-23
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Affilication of Author(s):
中国科学技术大学
Disigner of the Invention:
王智华,liujianwei,wangjinlong
Patent description:
发明
Application Number:
201511005681.1
Number of Inventors:
4
Service Invention or Not:
no
Publication Date:
2016-03-23
Authorization Date:
2018-04-10
First Author:
yushuhong