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超导真空桥及其制备方法
Release time:2021-07-24
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- Affilication of Author(s):
- 中国科学技术大学
- Disigner of the Invention:
- 叶杨森,王石宇,严凯,张海斌,denghui,zhuxiaobo,panjianwei
- Patent description:
- 发明公开
- Application Number:
- 201811381573.8
- Number of Inventors:
- 8
- Service Invention or Not:
- no
- Publication Date:
- 2019-01-29
- First Author:
- RongHao
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