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一种芯片封装结构、装置及方法
Release time:2021-07-24
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- Affilication of Author(s):
- 中国科学技术大学
- Disigner of the Invention:
- denghui,gongming,wuyulin,pengchengzhi,zhuxiaobo,panjianwei
- Patent description:
- 发明公开
- Application Number:
- 201910670287.1
- Number of Inventors:
- 7
- Service Invention or Not:
- no
- Publication Date:
- 2019-11-12
- First Author:
- Liang Futian
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