潘建伟

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Administrative Position:未来技术学院院长

Contact Information:63600070

Degree:Dr

Patents

Current position: Home > Scientific Research > Patents

可扩展的量子芯片封装盒结构

Release time:2021-07-24
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Affilication of Author(s):
中国科学技术大学
Disigner of the Invention:
gongming,denghui,wuyulin,pengchengzhi,zhuxiaobo,panjianwei
Patent description:
实用新型申请
Application Number:
201921167618.1
Number of Inventors:
7
Service Invention or Not:
no
First Author:
Liang Futian