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用于超导量子处理器封装的配合结构及封装盒体
Release time:2021-07-24
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- Affilication of Author(s):
- 中国科学技术大学
- Disigner of the Invention:
- 杨威风,denghui,gongming,wuyulin,pengchengzhi,zhuxiaobo,panjianwei
- Patent description:
- 实用新型申请
- Application Number:
- 201921167660.3
- Number of Inventors:
- 8
- Service Invention or Not:
- no
- First Author:
- Liang Futian
- Pre One:基于形状保护的信号连接结构及封装盒体
- Next One:键合结构及包含该键合结构的封装盒体