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一种基于缺电子苯甲醛的无催化剂腙连接多肽或蛋白质化学修饰方法
Release time:2021-07-24 Hits:
Affilication of Author(s): 中国科学技术大学
Disigner of the Invention: shijing,王玉
Patent description: 发明
Application Number: 201810711147.X
Number of Inventors: 3
Service Invention or Not: no
Publication Date: 2018-12-07
First Author: xuyang