孙永福

Click:

The Founding Time:..

The Last Update Time:..

· Scan attention

·Patents

Current position: Home > Scientific Research > Patents
含中间能带的半导体的制备方法及应用
Release time:2021-07-24  Hits:

Affilication of Author(s): 中国科学技术大学

Disigner of the Invention: liangjing,xieyi

Patent description: 发明公开

Application Number: 201710671195.6

Number of Inventors: 3

Service Invention or Not: no

Publication Date: 2019-02-26

First Author: Sun Yongfu