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含中间能带的半导体的制备方法及应用
Release time:2021-07-24  Hits:
Affilication of Author(s): 中国科学技术大学
Disigner of the Invention: liangjing,xieyi
Patent description: 发明公开
Application Number: 201710671195.6
Number of Inventors: 3
Service Invention or Not: no
Publication Date: 2019-02-26
First Author: Sun Yongfu