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DOI码：10.1117/1.OE.57.5.054101
发表刊物：Optical Engineering
摘要：There is an urgent demand for high-accuracy, real-time three-dimensional (3-D) shape measurements in industrial production as an ideal tool for quality control. Based on 3-D digital image correlation (3D-DIC), in this study, we measured micro-stair-steps of solder paste and printed circuits on circuit boards. The 3-D shapes of the circuit boards were successfully reconstructed, and the shapes of both solder paste and printed circuits were identified with high accuracy. To evaluate the performance of the 3D-DIC method, a stylus profiler was used to conduct shape measurements for printed circuit boards (PCBs), and comparisons were made between the results of 3D-DIC and the stylus profiler. The experimental results demonstrate that: (1) printed circuits with a length of several tens of microns can be measured with an accuracy of 3 μm using 3D-DIC in a field of view of 14 × 12 mm²; (2) the time required for 3-D reconstruction was less than 1 s for a 500 × 500 image with a grid step of 3 and a subset size of 19 on a consumer-grade computer (i7 4790k CPU, 16 GB of memory), thus meeting the requirements of online and real-time shape measurements of PCBs; and (3) for printed circuit measurements, the subset size chosen should be close to or slightly larger than the width of the printed circuit.
论文类型：期刊论文
论文编号：054101
文献类型：J
卷号：57
期号：5
是否译文：否
发表时间：2018-05-01
收录刊物：SCI