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基于电涡流传感器的导电膜厚度测量系统及方法

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  • Affilication of Author(s):中国科学技术大学

  • Disigner of the Invention:Hongbo Wang,liwei,琚斌

  • Patent description:发明

  • Application Number:201410412326.5

  • Number of Inventors:4

  • Service Invention or Not:no

  • Publication Date:2014-11-19

  • Authorization Date:2017-11-28

  • First Author:fengzhihua

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