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陶瓷颗粒增强复合钎料
Release time:2021-07-23 Hits:
Affilication of Author(s): 中国科学技术大学
Disigner of the Invention: 杨鹏飞,wanghaiqian,姜友松,宋亦周
Patent description: 发明
Application Number: 200810106217.5
Number of Inventors: 5
Service Invention or Not: no
Publication Date: 2008-10-22
Authorization Date: 2012-02-15
First Author: xiebin