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一种用于二维材料处理的找平装置
Release time:2021-07-24 Hits:
Affilication of Author(s): 中国科学技术大学
Disigner of the Invention: wangjianlin,yangmengmeng,Zhengping Fu,邹维,崔佳萌,赵志博,huanghaoliang,huangqiuping
Patent description: 发明公开
Application Number: 201811229679.6
Number of Inventors: 9
Service Invention or Not: no
Publication Date: 2019-03-26
First Author: luyalin