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基于硅基板的射频前端开发

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  • Teaching and Research Group:电子科学与技术系

  • Status:进行

  • Note:冻结第一笔到款2.8万元至尾款到账后解冻

  • Classification of Project:预付合同

  • Nature of Project:横向项目

  • Supported by:其他课题

  • Project Number:KD1311050176

  • Date of Project Approval:2013-11-05

  • Scheduled completion time:2015-04-30

  • Date of Project Initiation:2013-11-05

  • Subsidy Amount:28.0

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