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制备大位阻缺电子有机膦配体化合物的方法
Release time:2021-07-24
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- Affilication of Author(s):
- 中国科学技术大学
- Disigner of the Invention:
- 杨硕,江伟韬
- Patent description:
- 发明公开
- Application Number:
- 201910675173.6
- Number of Inventors:
- 3
- Service Invention or Not:
- no
- Publication Date:
- 2019-11-22
- First Author:
- xiaobin
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