陶瓷颗粒增强复合钎料

Affilication of Author(s):中国科学技术大学

Disigner of the Invention:杨鹏飞,wanghaiqian,姜友松,宋亦周

Patent description:发明

Application Number:200810106217.5

Number of Inventors:5

Service Invention or Not:no

Publication Date:2008-10-22

Authorization Date:2012-02-15

First Author:xiebin