Affilication of Author(s):中国科学技术大学
Disigner of the Invention:马小栋
Patent description:发明
Application Number:201810153616.0
Number of Inventors:2
Service Invention or Not:no
Publication Date:2018-11-13
First Author:zhanghui
Pre One:可分离式真空互联系统
Next One:二维碳氮单晶合金及其制备方法
The Last Update Time:..