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一种基于GPU嵌入式平台的玉米破损率检测方法
Release time:2021-07-24
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- Affilication of Author(s):
- 中国科学技术大学
- Disigner of the Invention:
- 张大勇,Quan Zheng,wangsong,xujun,lifeng
- Patent description:
- 发明
- Application Number:
- 201710669925.9
- Number of Inventors:
- 6
- Service Invention or Not:
- no
- Publication Date:
- 2017-12-26
- First Author:
- lingqiang
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