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超薄纳米片半导体材料及其制备方法和应用
Release time:2021-07-23 Hits:
Affilication of Author(s): 中国科学技术大学
Disigner of the Invention: zhoujun,zhouxiaoli,王文亮,luyalin
Patent description: 发明
Application Number: 201210567629.5
Number of Inventors: 5
Service Invention or Not: no
Publication Date: 2014-07-02
Authorization Date: 2016-01-20
First Author: Yang Qing