Qr code
Login 中文
朱晓波

Professor


E-Mail:

Degree:博士

Click:Times

The Last Update Time: ..

Current position: Home >> Scientific Research >> Patents
一种芯片封装结构、装置及方法

Hits:

Affilication of Author(s):中国科学技术大学

Disigner of the Invention:denghui,gongming,wuyulin,pengchengzhi,zhuxiaobo,panjianwei

Patent description:发明公开

Application Number:201910670287.1

Number of Inventors:7

Service Invention or Not:no

Publication Date:2019-11-12

First Author:Liang Futian