碳包覆凹凸棒黏土复合材料及其制备方法
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Affilication of Author(s):中国科学技术大学
Disigner of the Invention:Li-Feng CHEN,lianghaiwei
Patent description:发明
Application Number:201110316791.5
Number of Inventors:3
Service Invention or Not:no
Publication Date:2013-04-24
First Author:yushuhong
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