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碳包覆凹凸棒黏土复合材料及其制备方法

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  • Affilication of Author(s):中国科学技术大学

  • Disigner of the Invention:Li-Feng CHEN,lianghaiwei

  • Patent description:发明

  • Application Number:201110316791.5

  • Number of Inventors:3

  • Service Invention or Not:no

  • Publication Date:2013-04-24

  • First Author:yushuhong


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