Yang Shu
- Professor
- Supervisor of Doctorate Candidates
- Supervisor of Master's Candidates
- Name (Pinyin):Yang Shu
- Business Address:School of Microelectronics, University of Science and Technology of China 242 Huangshan Road, Hefei, 230026 China
- Degree:Dr
- Professional Title:Professor
- Alma Mater:The Hong Kong University of Science and Technology
- Teacher College:School of Microelectronics
- Discipline:Electronic Science and Technology
- ZipCode:
- PostalAddress:
- Email:
- Profile
- Research Focus
- Honors & Awards
- Social Affiliations
Shu Yang
Professor
IEEE Senior Member
School of Microelectronics
University of Science and Technology of China
Hefei 230026, China
Email: eesyang@ustc.edu.cn
Research Area
Fabrication, characterization and application-relevant study of vertical GaN-on-GaN and lateral GaN-on-Si power devices
Work Experience
2016 Postdoctoral Research Associate, University of Cambridge, Cambridge
2014~2016 Visiting Assistant Professor, The Hong Kong University of Science and Technology, Hong Kong
Education Experience
2010~2014 The Hong Kong University of Science and Technology, Ph.D. in Electronic and Computer Engineering
(Advisor: IEEE Fellow, Prof. Kevin J. Chen)
2006~2010 Fudan University, B.Sc.
Selected Honors and Awards
2018 IEEE ISPSD Charitat Young Researcher Award
2022 Damo Academy Young Fellow
2022 MIT Technology Review Innovator Under 35 (Asia Pacific)
2020 China Power Supply Society - Young Scholar Award
2020 Zhongda Young Scholar Award
2016 Outstanding Young Scientist, China Advanced Semiconductor Industry Innovation Alliance (CASA)
2015 SENG PhD Research Excellence Award, HKUST
2010 Hong Kong PhD Fellowship (HKPF), Research Grants Council (RGC), Hong Kong
Academic Service/Activities
Member:
IEEE EDS Power Devices and ICs Committee
WiS-CPSS
Co-Editor-in-Chief:
Power Electronic Devices and Components
Guest Associate Editor:
IEEE Journal of Emerging and Selected Topics in Power Electronics
─ Special Issue on Modeling, Design and Application of Next-Generation Power Components
─ Special Issue on Power Integration with WBG Devices and Components
Conference Committee Member:
Technical Program Committee: IEEE ISPSD (2019~2023), IEEE ECCE'2022/2023, IEEE EDTM'2022/2023, IEEE ISPSD’2019, IEEE PEAC’2018
Organizing Committee: IEEE ISPSD’2019, IEEE WiPDA Asia’2018
IEEE Senior Member
Reviewer for IEEE EDL, IEEE T-ED, IEEE T-PEL, IEEE T-IE, IEEE JESTPE, APL, etc.
No content
No content
No content
No content
No content
No content
No content