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一种基于GPU嵌入式平台的玉米破损率检测方法

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  • Affilication of Author(s):中国科学技术大学

  • Disigner of the Invention:张大勇,zhengquan,wangsong,xujun,lifeng

  • Patent description:发明

  • Application Number:201710669925.9

  • Number of Inventors:6

  • Service Invention or Not:no

  • Publication Date:2017-12-26

  • First Author:lingqiang
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