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刘建北

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Current position: Home >> Scientific Research >> Patents
用于大面积Micromegas探测器制作的热熔胶膜热压接方法

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Affilication of Author(s):中国科学技术大学

Disigner of the Invention:丰建鑫,齐斌斌,管亮,wangxiaolian,赵天池,liujianbei,Ming Shao,周意

Patent description:发明

Application Number:201810274814.2

Number of Inventors:9

Service Invention or Not:no

Publication Date:2018-09-14

First Author:zhangzhiyong