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刘建北

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Current position: Home >> Scientific Research >> Patents
一种在软基材表面制备低应力DLC薄膜的方法

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Affilication of Author(s):中国科学技术大学

Disigner of the Invention:吕游,尚伦霖,张广安,鲁志斌,liujianbei,zhangzhiyong,丰建鑫

Patent description:发明

Application Number:201810314406.5

Number of Inventors:8

Service Invention or Not:no

Publication Date:2018-09-11

First Author:周意