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Development of a tight-binding model for Cu and its application to a
Cu-heat-sink under irradiation
Release time:2021-07-23 Hits:
Impact Factor: 3.553
DOI number: 10.1007/s10853-015-9097-7
Journal: JOURNAL OF MATERIALS SCIENCE
Correspondence Author: Pan BiCai
Document Code: 000355951100003
Volume: 50
Issue: 17
Page Number: 5684-5693
ISSN No.: 0022-2461
Translation or Not: no
Date of Publication: 2015-08-31
Included Journals: SCI