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Structural features and thermal properties of W/Cu compounds using
tight-binding potential calculations
Release time:2021-07-23 Hits:
Impact Factor: 3.553
DOI number: 10.1007/s10853-016-9896-5
Journal: JOURNAL OF MATERIALS SCIENCE
Correspondence Author: Pan BiCai
Document Code: 000373626000033
Volume: 51
Issue: 12
Page Number: 5948-5961
ISSN No.: 0022-2461
Translation or Not: no
Date of Publication: 2016-05-31
Included Journals: SCI