代表性工作

D. Pan, W. Xu, X. Wu and L. Cheng, A 24–20-V Isolated DC–DC Converter Using a Transformer-Based Supply-Generating Technique, in IEEE Journal of Solid-State Circuits (JSSC), early access, doi: 10.1109/JSSC.2025.3566939.

Q. Huang#, D. Pan#, W. Xu, Y. Zhang and L. Cheng,  A 68%-Peak-Efficiency Single-Transformer Multi-Output Isolated DC-DC Converter with a Regulated Negative Rail, in IEEE International Solid-State Circuits Conference (ISSCC), Feb. 2026 (accepted). (#Equally Credited Authors)

D. Pan, X. Zhang, Z. Zhang, W. Jing and L. Cheng, A 77-GHz Power-Controlled PA With Reusable Coupled-Line-Based Power Combining and Temperature Predistortion Technique in 28-nm CMOS, in IEEE Transactions on Microwave Theory and Techniques (TMTT), vol. 73, no. 11, pp. 9472-9483, Nov. 2025.

D. Pan, W. Xu, L. Zhang, Q. Huang and L. Cheng, A 2W 53.2%-Peak-Efficiency Multi-Core Isolated DC-DC Converter with Embedded Magnetic-Core Transformer Achieving CISPR-32 Class-B EMI Compliance and <5 mV Ripple, IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, USA, pp. 536-538, Feb. 2025.

Q. Huang#, D. Pan#, Z. Chen and L. Cheng, A Dual-LC-Resonant Isolated DC-DC Converter Achieving 65.4% Peak Efficiency and Inherent Backscattering, IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, USA, pp. 534-536, Feb. 2025. (#Equally Credited Authors)

D. Pan, A. Li, W. Sun and L. Cheng, An Isolated DC–DC Converter Using a Cross-Coupled Shoot-Through-Free Class-D Oscillator with Low EMI Emissions, IEEE Journal of Solid-State Circuits (JSSC), vol. 59, no. 10, pp. 3457-3467, Oct. 2024.

D. Pan, G. Li, F. Miao, W. Sun, X. Gong, L. Zhang, L. Cheng. A 1.2W 51%-Peak-Efficiency Isolated DC-DC Converter with a Cross-Coupled Shoot-Through-Free Class-D Oscillator Meeting the CISPR-32 Class-B EMI Standard, 2022 IEEE International Solid- State Circuits Conference (ISSCC), San Francisco, CA, USA, 2022. pp. 240-242.

D. Pan, G. Li, F. Miao, B. Deng, J. Wei, D. Yu, M. Liu, L. Cheng. 33.5 A 1.25W 46.5%-Peak-Efficiency Transformer-in-Package Isolated DC-DC Converter Using Glass-Based Fan-Out Wafer-Level Packaging Achieving 50mW/mm2 Power Density, 2021 IEEE International Solid- State Circuits Conference (ISSCC), San Francisco, CA, USA, 2021, pp. 468-470. (First ISSCC paper from USTC)

C. Wang, B. Deng, M. Liu, Y. Wang, D. Pan* and L. Sun, An E-Band Frequency Quadrupler With Temperature Compensation Technique in 28-nm Bulk CMOS, in IEEE Microwave and Wireless Technology Letters (IEEE MWTL), vol. 35, no. 11, pp. 1811-1814, Nov. 2025.

S. Wu, D. Pan*, L. Jin and L. Cheng, An Ultra-Compact Ka-Band Folded Phased-Array Transceiver Front-End With Bidirectional 20-dB Gain Control, in IEEE Transactions on Circuits and Systems II: Express Briefs (TCAS-II), vol. 72, no. 9, pp. 1203-1207, Sept. 2025.

X. Zhang, B. Deng, L. Sun, D. Pan* and L. Cheng, A W-Band 0.18-dB RMS Gain and 0.97° Phase Error Active Phase Shifter in 28-nm CMOS, IEEE Microwave and Wireless Technology Letters (MWTL), vol. 34, no. 7, pp. 923-926, July 2024

D. Pan, Z. Duan; B. Wu; Y. Wang; D. Huang; Y. Wang; L. Sun; P. Gui; L. Cheng. A 76–81-GHz Four-Channel Digitally Controlled CMOS Receiver for Automotive Radars[J], in IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I), vol. 68, no. 3, pp. 1091-1101, March 2021.

D. Pan et al., “A 77-GHz Power Amplifier with Digital Power Control for Multi-Mode Automotive Radar in 28-nm Bulk CMOS,” IEEE Transactions on Circuits and Systems II: Express Briefs (TCAS-II), vol. 70, no. 3, pp. 875–879, 2023.