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可扩展的量子芯片封装盒结构及其制作方法
Release time:2021-07-24
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- Affilication of Author(s):
- 中国科学技术大学
- Disigner of the Invention:
- gongming,denghui,wuyulin,pengchengzhi,zhuxiaobo,panjianwei
- Patent description:
- 发明公开
- Application Number:
- 201910669893.1
- Number of Inventors:
- 7
- Service Invention or Not:
- no
- Publication Date:
- 2019-11-19
- First Author:
- Liang Futian
- Pre One:提高超导量子处理器谐振频率的封装盒体结构
- Next One:键合结构、键合方法及包含该键合结构的封装盒体