中文
Login
提高超导量子处理器谐振频率的封装盒体结构
Release time:2021-07-24
Hits:
- Affilication of Author(s):
- 中国科学技术大学
- Disigner of the Invention:
- 杨威风,denghui,gongming,wuyulin,pengchengzhi,zhuxiaobo,panjianwei
- Patent description:
- 发明公开
- Application Number:
- 201910669894.6
- Number of Inventors:
- 8
- Service Invention or Not:
- no
- Publication Date:
- 2019-11-12
- First Author:
- Liang Futian
- Pre One:用于超导量子处理器封装的配合结构及封装盒体
- Next One:可扩展的量子芯片封装盒结构及其制作方法