[53] Asymmetric magnetic nanosnowman loaded with AgPd nanocage toward NIR-enhanced catalytic activity, J Jin, H Li, H Wang, Q Fang*, Y Xu, W Kong, X Chen,  K C Leung, H Wang*, S Xuan, Dalton Trans., 53: 17864, 2024

[52] Nanoscale particle-droplet coalescence-induced jumping on superhydrophobic surfaces: insights from molecular dynamics simulations, C Xue, X Han, J Liu, H A*, Z Yang, H Wang*, Colloids Surf. A Physicochem. Eng. Asp., 703: 135171, 2024

[51] Electric field induced out-of-plane second-order optical nonlinearity in monolayer transition metal dichalcogenides, Z Guan, Y Xu, J Li,  H Wang, Z Peng, D Lei, DJ Srolovitz, Phys. Rev. B. 109 (7): 075417, 2024

[50] Ultra-long-range force transmission in fiber networks enabled by multiaxial mechanical coupling, J Liu, M Wang, C Xue, H Wang, H Wang*, Int. J Solids. Struct., 291: 112698, 2024

[49] A MXene@AgAu@PDA nanoplatform loaded with AgAu nanocages for enhancing catalytic activity and antibacterial performance, G Liu, H Wang, C Xu*, Q Fang, H Wang*,  Y Xu, M Sang, S Xuan* and L Hao*, J. Mater. Chem. B, 11: 10678, 2023

[48] Emergent grain boundary phases in stressed polycrystalline thin films, M Wang, R Yan, X Han, H Wang*, M Upmanyu*, Phys. Rev. Mater. 7 (8): 083602, 2023

[47] X Zhang*, M Wang, H Wang*, M Upmanyu*, J Boland*, Restructuring of emergent grain boundaries at free surfaces – an interplay between core stabilization and elastic stress generation, Acta Mater., 242: 118432, 2023

[46] X Han, J Liu, M Wang, M Upmanyu*, H Wang*, Microgroove convexity is critical for robust gaseous layers on heirarachically-structured superhydrophobic surfaces, ACS Appl. Mater. Interfaces, 14: 52524–5253, 2022

[45] W Yang, Z Guan, H Wang, Y Chen, H Wang*, J Li*,Ultrahigh anisotropic carrier mobility in ZnSb monolayers functionalized with halogen atoms, RSC Adv., 12(5): 2693–2700, 2022

[44] S Gao, S Hong, S Park, HY Jung, W Liang, Y Lee, CW Ahn, JY Byun, J Seo, MG Hahm, H Kim, K, Kim, Y Yi, H Wang, M Upmanyu, SG Lee, Y Homma, H Terrones, YJ Jung, Catalyst-Free synthesis of sub-5 nm silicon nanowire arrays with massive lattice contraction and Wide-Bandgap, Nat. Commun., 13: 3467, 2022

[43] Y Chen, Z Guan, J Liu, H Wang*, Anomalous layer-dependent lubrication on graphene-covered-substrate due to competition between adhesion and plasticity, Appl. Surf. Sci., 598: 153762, 2022

[42] Z Guan, W Yang, H Wang, H Wang*, J Li*, Direct band gap and anisotropic transport of ZnSb monolayers tuned by hydrogenation and strain, RSC Adv., 12(5): 2693–2700, 2022

[41] X Han, M Wang, R Yan, H Wang*, Cassie state stability and gas restoration capability of superhydrophobic surfaces with truncated cone-shaped pillars, Langmuir, 37(44): 12897–12906, 2021, Cover Paper

[40] {M Wang, Y Peng}, H Wang*, M Upmanyu*, Coarsening of polycrystalline patterns in atomically thin surface crystals, Appl. Phys. Lett., 119(12): 123102, 2021

[39] H Wang*, M Wang, A Shahabi, A Karma, M Upmanyu*, Stability and energetics of 2D surface crystals in liquid AuSi thin films and nanoscale droplets, Phys. Rev. Mater., 5(7): 074003, 2021

[38] Y Chen, Z Guan, W Yang, Y Yao, H Wang*, Tuning nanoscale adhesive contact behavior to ideal Hertzian state via graphene coverage, Compt. Mater. Sci., 194(15): 110427, 2021

[37] Y Peng, Z Guan, M Wang, Y Yao, T Luo, H Wang*, Cooling rate-dependent microstructure and mechanical properties of thin surface crystals in liquid AuSi films, Chem. Phys. Lett., 768: 138381, 2021

[36] W Yang, Z Guan, H Wang*, J Li*, Ideal strength and strain engineering of Rashba effect in twodimensional BiTeBr, Phys. Chem. Chem. Phys., 23(11): 6552–6560, 2021

[35] L Liu, J Tian, H Yang, Y Chen, J Li, H Wang, H Jiang, Z Zhao, T Luo*, The measurement and analysis and of the surface wrinkling of the calyx tip in Arabidopsis thaliana, J Exp. Mech., 35(6): 970-977, 2020 (in Chinese)

[34] S Abbasi, T Kim, S Somu, H Wang, Z Chai, M Upmanyu, A Busnaina*, Fabrication of a Nanoelectromechanical Bistable Switch Using Directed Assembly of SWCNTs, J. Phys. D, 53: 23LT02, 2020

[33] H Wang, ET Nilsen, M Upmanyu*, Mechanical basis for thermonastic movements of coldhardy Rhododendron leaves, J. R. Soc. Interface, 17(164): 20190751, 2020, Cover Paper

[32] B Ehsan, H Wang, JM Franklin, JT Liphardt, PA Janmey, VB Shenoy*, Strong triaxial coupling and anomalous Poisson effect in collagen networks, Proc. Natl. Acad. Sci. USA, 116(14): 6790–6799, 2019

[31] L Jia, K Ding, R Ma, H Wang, W Sun, D Yan*, B Li*, Z Li*, Highly conductive and machine-washable textiles for efficient electromagnetic Interference Shielding, Adv. Mater. Technol, 4(2): 1800503, 2019

[30] E Ban, M Franklin, S Nam, L Smith, H Wang, L Smith, RG Wells, J Liphardt, VB Shenoy*, Mechanisms of plastic deformation in collagen networks induced by cellular forces, Biophys. J., 114(2): 450-461, 2018

[29] S Yu, H Wang, Y Ni, L He, M Huang, Y Lin, J Qian*, H Jiang*, Tuning interfacial patterns of molecular bonds via surface morphology, Soft Matter, 13(35): 5970-5976, 2017

[28] D Li*, H Wang, D Xiao, M Song, J Chun, Investigating the magnitude and source of orientationdependent interactions between TiO2 crystal surfaces, Nanoscale, 9(29): 10173-10177, 2017,

[27] V Tutwiler, H Wang, RI Litvinov, JW Weisel, VB Shenoy*, Mechanical interplay of active platelet contraction with viscoelasticity of fibrin and erythrocytes drives clot retraction, Biophys. J., 112(4): 714-723, 2017, Cover Paper

[26] {AS Liu, H Wang, CR Copeland}, CS Chen, VB Shenoy*, Reich DH, Matrix viscoplasticity and its shielding by active mechanics in microtissue models: experiments and mathematical modeling, Sci. Rep., 6(9): 33919, 2016

[25] H Wang, SPV Nadimpalli, VB Shenoy*, Inelastic shape changes of silicon particles and stress evolution at binder/particle interface in a composite electrode during lithiation/delithiation cycling, Extreme Mech. Lett., 9(3): 430-438, 2016

[24] VB Shenoy*, H Wang, X Wang, A free energy-based approach to model durotaxis and extracellular stiffness dependent contraction and polarization of cells, Interface Focus, 6(1): 20150067, 2016

[23] H Wang, A Nair, RG Wells, CS Chen, VB Shenoy*, Long range force transmission in fibrous matrices enabled by tension-driven alignment of fibers, 107(11): 2592-2603, Biophys. J., 2014

[22] A Shahabi, H Wang, M Upmanyu*, Shaping van der Waals nanoribbons via torsional constraints: Scrolls, folds and supercoils, Sci. Rep., 4: 7004, 2014

[21] H Wang, AA Svoronos, T Boudou, MS Sakar, JY Schell, JR Morgan, CS Chen, VB Shenoy*, Necking and failure of constrained 3D microtissues induced by cellular tension, Proc. Natl. Acad. Sci. USA, 110(52): 20923-20928, 2013

[20] H Wang, LA Zepeda-Ruiz, GH Gilmer and M Upmanyu*, Atomistics of vapor-liquid-solid nanowire growth, Nat. Comm., 4, 1956, 2013

[19] VA Sethuraman, A Nguyen, MJ Chon, NSP Vadimpalli, H Wang, DP Abraham, AF Bower, VB Shenoy, PR Guduru*, Stress evolution in composite silicon electrodes during lithiation/delithiation, J. Electrochem. Soc., 160(4): A739, 2013

[18] H Wang, M Upmanyu*, Rippling instabilities in suspended nanoribbons, Phys. Rev. B, 86(20): 205411, 2012

[17] H Wang, M Upmanyu*, Saddles, twists, and curls: shape transitions in freestanding nanoribbons, Nanoscale, 4(12): 3620-3624, 2012, Cover Paper

[16] MG Hahm, H Wang, HY Jung, SH Hong, SG Lee, SR Kim, M Upmanyu*, YJ Jung*. Bundling dynamics regulates the active mechanics and transport in carbon nanotube networks and their nanocomposites, Nanoscale, 4(11): 3584-3590, 2012, Cover Paper

[15] B Li, HY Jung, H Wang, YL Kim, T Kim, MG Hahm, A Busnaina, M Upmanyu*, YJ Jung*. Ultra-thin SWNTs films with tunable, anisotropic transport properties, Adv. Func. Mater., 21(10): 1810-1815, 2011

[14] S Somu, H Wang, Y Kim, L Jaberansari, MG Hahm, B Li, T Kim, X Xiong, YJ Jung*, M Upmanyu*, A Busnaina *, Topological transitions in carbon nanotube networks via nanoscale confinement, ACS Nano, 4(7): 4142-4148, 2010

[13] H Wang, M Upmanyu*, CV Ciobanu, Morphology of epitaxial core-shell nanowires, Nano Lett., 8(12): 4305-4311, 2008

[12] M Upmanyu*, H Wang, H Liang, R Mahajan, Strain dependent twist-stretch elasticity in chiral filaments, J. R. Soc. Interface, 5(20): 303-310, 2008, Cover Paper

[11] H Wang, X Wang*, H Liang, Molecular dynamics simulation and analysis on the stress induced crystallization behavior of metallic glass Cu, Solid State Phenomena, 121: 1011-1016, 2007

[10] H Wang, X Wang*, Y Wang, H Liang, Atomistic simulation of deformation-induced crystallization mechanism in Amorphous Ti3Al Alloy, Acta Phys Sin, 56(3): 1489-1493, 2007 (in Chinese)

[9] H Wang, X Wang*, Y Wang, H Liang, Atomistic simulation of stress-induced crystallization behavior during the indentation process for amorphous Cu, Acta Metall Sin, 43(3): 259-263, 2007 (in Chinese)

[8] H Wang, X Wang*, Y Wang, H Liang, Molecular dynamics simulation of stress-induced crystallization behavior during indentation for metallic glass, Chinese J Nonferrous Metals, 17(1): 85-91, 2007 (in Chinese)

[7] Y Wang, X Wang*, H Wang, Atomic simulation on evolution of nano-crystallizaion in amorphous metals, T Nonferr Metal Soc, 16: S327-S331, 2006 (in Chinese)

[6] H Wang, X Wang*, Y Wang, H Liang, Molecular dynamics simulations of low index surfaces melting behaviors for metal Cu, Acta Phys-Chim Sin, 22(11): 1367-1371, 2006 (in Chinese)

[5] Y Wang, X Wang*, H Wang, Molecular dynamics simulation of nanocrystallization in amorphous material during compression deformation, Acta Metall Sin, 42(10): 1071-1074, 2006 (in Chinese)

[4] H Wang, X Wang*, H Liang, Molecular dynamics simulations of strain rate effect on stress induced crystallization for metallic glass Cu, Chinese Journal of Materials Research, 20(5): 474-478, 2006 (in Chinese)

[3] H Wang, X Wang*, H Liang, Molecular dynamics simulation of crystallizing and vitrifying processes for metal Cu, Chinese J Chem Phys, 18(6): 987-992, 2005 (in Chinese)

[2] H Wang, X Wang*, H Liang, Molecular dynamics simulation of strain effects on surface melting for metal Cu, Acta Physica Sinica, 54(10): 4836-4841, 2005 (in Chinese)

[1] H Wang, X Wang*, H Liang, Molecular dynamics simulation and analysis of bulk and surface melting processes for metal Cu, Acta Metall Sinica, 41(6): 568-572, 2005 (in Chinese)