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杨萍华

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Current position: Home >> Scientific Research >> Patents
改进负温度系数热敏材料均匀性的热处理方法

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Affilication of Author(s):合肥三晶电子有限公司;中国科学技术大学

Disigner of the Invention:王忠兵,chenchusheng,yangpinghua,刘原平

Patent description:发明

Application Number:200710025644.6

Number of Inventors:5

Service Invention or Not:no

Publication Date:2008-03-12

First Author:赵春花