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杨萍华

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Current position: Home >> Scientific Research >> Patents
一种负温度系数双相复合热敏材料及其制备方法

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Affilication of Author(s):合肥三晶电子有限公司;中国科学技术大学

Disigner of the Invention:yangpinghua,朱运兵,chenchusheng,刘原平

Patent description:发明

Application Number:200810021261.6

Number of Inventors:5

Service Invention or Not:no

Publication Date:2008-12-24

First Author:罗伟