Professor
E-Mail:1131e348ad918540c98acda5d0adf7fce229f08fd36363d27aca7e97284afa495071f4fbb6852d14e582ad3713bcfa307382259ef59a3ea77a9c8c17c17bcb0667b847fb4d22c2ddcc0499565df5233f864b745cb87bf13374730838d48a3a57c8dc6f5f7214c4a38a734caa0f89afe69ed170aadf5e34779029fdf4739704ff
Degree:Dr
The Last Update Time: ..
Hits:
Affilication of Author(s):中国科学技术大学
Disigner of the Invention:杨威风,wuyulin,pengchengzhi,zhuxiaobo,panjianwei
Patent description:实用新型申请
Application Number:201921167656.7
Number of Inventors:6
Service Invention or Not:no
First Author:Liang Futian
Pre One:键合结构及包含该键合结构的封装盒体
Next One:可扩展的量子芯片封装盒结构