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阵列式硅微超声换能器及其制造方法
Release time:2021-07-23 Hits:
Affilication of Author(s): 中国科学技术大学
Disigner of the Invention: 张晋弘,马剑强,Baoqing Li,冯艳
Patent description: 发明
Application Number: 201010175476.0
Number of Inventors: 5
Service Invention or Not: no
Publication Date: 2010-09-29
First Author: chujiaru