空穴型半导体异质结霍尔棒
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Affilication of Author(s):中国科学技术大学
Disigner of the Invention:袁龙,王柯,caogang,guoguangcan,guoguoping
Patent description:实用新型
Application Number:201720754071.X
Number of Inventors:6
Service Invention or Not:no
Publication Date:2018-04-10
Authorization Date:2018-04-10
First Author:Li Hai Ou
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