半导体量子芯片及其制作方法
Hits:
Affilication of Author(s):中国科学技术大学
Disigner of the Invention:井方铭,王柯,luogang,王桂磊,guoguoping
Patent description:发明公开
Application Number:201910366161.5
Number of Inventors:6
Service Invention or Not:no
Publication Date:2019-08-02
First Author:Li Hai Ou
-
|
|