刘正坤

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一种光栅掩模与硅片{111}晶面的对准方法

Release time:2021-07-23
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Affilication of Author(s):
中国科学技术大学
Disigner of the Invention:
liuzhengkun,qiukeqiang,郑衍畅,liuying,hongyilin
Patent description:
发明
Application Number:
201510793828.1
Number of Inventors:
6
Service Invention or Not:
no
Publication Date:
2016-03-23
Authorization Date:
2018-08-03
First Author:
wangyu