一种光栅掩模与硅片{111}晶面的对准方法
Release time:2021-07-23
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- Affilication of Author(s):
- 中国科学技术大学
- Disigner of the Invention:
- liuzhengkun,qiukeqiang,郑衍畅,liuying,hongyilin
- Patent description:
- 发明
- Application Number:
- 201510793828.1
- Number of Inventors:
- 6
- Service Invention or Not:
- no
- Publication Date:
- 2016-03-23
- Authorization Date:
- 2018-08-03
- First Author:
- wangyu
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