- 1. Z. Han, S. Yang*, M. Wang, C. Chu and S. Long, "Achieving 205 cm2V-1s-1 Inversion Channel Mobility in 1.4 kV Vertical GaN-on-GaN MISFET with Nitride Gate Dielectric," 2024 IEEE International Electron Devices Meeting (IEDM), p. 40.2.1, Dec. 2024 (Featured in Compound Semiconductor).
- 2. J. Du, C. Sun, Q. Tang, B. Jang, Z. Dong, X. Wu, S. Yang*, "An Efficient Switching Transient Analytical Model for P-GaN Gate HEMTs With Dynamic CG(VDS, VGS)," IEEE Trans. Power Electron., vol. 40, no. 1, pp. 2139-2148, Jan. 2025.
- 3. Z. Han, H. Zhang, S. Long, S. Yang*, "Low On-Resistance Vertical GaN-on-GaN Trench MIS-FET with Small Temperature Dependence," 37th IEEE Int. Symp. on Power Semiconductor Devices and ICs (ISPSD), 2025.
- 4. S. Li, K. Sheng, and S. Yang*, "Temperature-Dependent Dynamic Ron of GaN E-HEMTs: The Impact of p-GaN Drain," IEEE Trans. Electron Devices, vol. 70, no. 7, pp. 3754-3761, July 2023.
- 5. S. Han, S. Yang*, and K. Sheng,"Conductivity modulation in vertical GaN PiN diode: Evidence and impact," IEEE Electron Device Lett., Vol. 42, no. 3, pp.300-303, Mar. 2021. (Featured in CompoundSemiconductor).
- 6. (invited) S. Yang*, S. Han, K. Sheng, and K. J. Chen,"Dynamic on-resistance in GaN power devices: Mechanisms, characterizations and modeling," IEEE J. Emerg. Sel. Topics Power Electron., vol. 7, no. 3, pp. 1425-1439, Sep. 2019.
- 7. S. Han, S. Yang*, and K. Sheng, "Fluorine-implanted termination for vertical GaN Schottky rectifier with high blocking voltage and low forward voltage drop," IEEE Electron Device Lett., vol. 40, no. 7, pp. 1040–1043, Jul. 2019.
- 8. S. Han, S. Yang*, R. Li, X. Wu, and K. Sheng, "Current-collapse-free and fast reverse recovery performance in vertical GaN-on-GaN Schottky barrier diode," IEEE Trans. Power Electron., vol. 36, no. 6, pp. 5012-5018, Jun. 2019. (Featured in Compound Semiconductor and Semiconductor Today).
- 9. S. Han, S. Yang*, and K. Sheng, "High-voltage and high-ION/IOFF vertical GaN-on-GaN Schottky barrier diode with nitridation-based termination," IEEE Electron Device Lett., vol. 39, no. 4, pp. 572–575, Apr. 2018. (Featured in Compound Semiconductor and Semiconductor Today).
- 10. S. Yang*, C. Zhou, S. Han, J. Wei, K. Sheng, and K. J. Chen, "Impact of substrate bias polarity on buffer-related current collapse in AlGaN/GaN-on-Si power devices," IEEE Trans. Electron Devices, vol. 64, no. 12, pp. 5048–5056, Dec. 2017.