- 1. (invited) S. Yang*, S. Han, K. Sheng, and K. J. Chen,"Dynamic on-resistance in GaN power devices: Mechanisms, characterizations and modeling," IEEE J. Emerg. Sel. Topics Power Electron., vol. 7, no. 3, pp. 1425-1439, Sep. 2019.
- 2. S.Han, S.Yang*, and K. Sheng,“Conductivity modulation in vertical GaN PiN diode: Evidence and impact,” IEEE Electron Device Lett., Vol. 42, no. 3, pp.300-303, Mar. 2021. (Featured in CompoundSemiconductor).
- 3. S. Li, K. Sheng, and S. Yang*, "Temperature-Dependent Dynamic Ron of GaN E-HEMTs: The Impact of p-GaN Drain," IEEE Trans. Electron Devices, vol. 70, no. 7, pp. 3754-3761, July 2023.
- 4. S. Han, S. Yang*, R. Li, X. Wu, and K. Sheng, “Current-collapse-free and fast reverse recovery performance in vertical GaN-on-GaN Schottky barrier diode,” IEEE Trans. Power Electron., vol. 36, no. 6, pp. 5012-5018, Jun. 2019. (Featured in Compound Semiconductor and Semiconductor Today).
- 5. S. Han, S. Yang*, and K. Sheng, “High-voltage and high-ION/IOFF vertical GaN-on-GaN Schottky barrier diode with nitridation-based termination,” IEEE Electron Device Lett., vol. 39, no. 4, pp. 572–575, Apr. 2018. (Featured in Compound Semiconductor and Semiconductor Today).
- 6. Y. Liu, S. Yang*, S. Han, and K. Sheng, “Investigation of surge current capability of GaN E-HEMTs in the third quadrant: the impact of p-GaN contact,” IEEE J. Emerg. Sel. Topics Power Electron., vol. 7, no. 3, pp. 1465-1474, Sep. 2019.
- 7. S. Han, S. Yang*, and K. Sheng, “Fluorine-implanted termination for vertical GaN Schottky rectifier with high blocking voltage and low forward voltage drop,” IEEE Electron Device Lett., vol. 40, no. 7, pp. 1040–1043, Jul. 2019.
- 8. S. Yang*, S. Han, R. Li, and K. Sheng, “1 kV/1.3 mΩ·cm2 vertical GaN-on-GaN Schottky barrier diodes with high switching performance,” 30th Int. Symp. on Power Semiconductor Devices and ICs (ISPSD), Chicago, USA, May 13-17, 2018. (IEEE ISPSD Charitat Young Researcher Award).
- 9. S. Yang*, C. Zhou, S. Han, J. Wei, K. Sheng, and K. J. Chen, “Impact of substrate bias polarity on buffer-related current collapse in AlGaN/GaN-on-Si power devices,” IEEE Trans. Electron Devices, vol. 64, no. 12, pp. 5048–5056, Dec. 2017.
- 10. S. Yang*, Z. Tang, K. Wong, Y. Lin, C. Liu, Y. Lu, S. Huang, and K. J. Chen, “High-quality interface in Al2O3/GaN/AlGaN/GaN MIS-structures with in situ pregate plasma nitridation,” IEEE Electron Device Lett., vol. 34, no. 12, pp. 1497–1499, Dec. 2013. (ESI Highly Cited Paper; Featured in Compound Semiconductor and Semiconductor Today).